Invention Grant
- Patent Title: Bus bar module
- Patent Title (中): 总线模块
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Application No.: US14412219Application Date: 2013-07-08
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Publication No.: US09190651B2Publication Date: 2015-11-17
- Inventor: Haifeng Liu , Yukihisa Kikuchi
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Mots Law, PLLC
- Agent Marvin A. Motsenbocker
- Priority: JP2012-153327 20120709
- International Application: PCT/JP2013/068647 WO 20130708
- International Announcement: WO2014/010557 WO 20140116
- Main IPC: H01M2/20
- IPC: H01M2/20 ; H01M2/10 ; H01R13/447

Abstract:
A bus bar module (1) includes: a first module body section (3) provided with an output terminal installation section (13); a second module body section (5) detachably attached to the first module body section; an output terminal cover (19) provided to the first module body section using a hinge section (21), and configured to cover an output terminal; a cover latch section (23) provided to the output terminal cover; a cover latching section (27) to which the cover latch section of the output terminal cover is fastened; and a reinforcing section (31) configured to come into engagement with the output terminal installation section when the second module body section is installed on the first module body section, and configured to prevent deformation of the output terminal installation section.
Public/Granted literature
- US20150180005A1 BUS BAR MODULE Public/Granted day:2015-06-25
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