Invention Grant
- Patent Title: Hybrid grounding connector
- Patent Title (中): 混合接地连接器
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Application No.: US14169828Application Date: 2014-01-31
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Publication No.: US09190741B2Publication Date: 2015-11-17
- Inventor: Matthew D. Cawood
- Applicant: Thomas & Betts International LLC
- Applicant Address: US DE Wilmington
- Assignee: Thomas & Betts International LLC
- Current Assignee: Thomas & Betts International LLC
- Current Assignee Address: US DE Wilmington
- Agency: Hoffmann & Baron, LLP
- Main IPC: H01R4/00
- IPC: H01R4/00 ; H01R4/18 ; H01R43/048 ; H01R4/60
Abstract:
A hybrid grounding connector is provided which combines the positive attributes of currently used connections. A recess is pre-milled, formed or extruded into the body of a compression connector and the recess is pre-filled with solder. After conductors are installed in the connector, an external heat source is applied to heat the solder until it flows into strands of the conductors and forms a solidified joint of the compression connector.
Public/Granted literature
- US20140273560A1 Hybrid Grounding Connector Public/Granted day:2014-09-18
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