Invention Grant
- Patent Title: Dual memory card socket
- Patent Title (中): 双存储卡插座
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Application No.: US13874033Application Date: 2013-04-30
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Publication No.: US09190788B2Publication Date: 2015-11-17
- Inventor: In-Ho You , In-Chull Yang
- Applicant: Molex, LLC
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Priority: KR10-2012-0045143 20120430
- Main IPC: H01R24/00
- IPC: H01R24/00 ; H01R24/62 ; G06K7/00 ; H01R13/24 ; H01R27/02
Abstract:
The Present Disclosure relates to mold a micro SIM card connecting terminal and a micro SD card connecting terminal by means of an integrated terminal mold, so as to significantly reduce the whole length of the dual memory card socket and manufacturing method thereof. The Present Disclosure is formed by a structure manufactured by molding the micro SIM card connecting terminal and the micro SD card connecting terminal by means of an integrated terminal mold, and then separating them by a cutting process.
Public/Granted literature
- US20130288535A1 DUAL MEMORY CARD SOCKET Public/Granted day:2013-10-31
Information query
