Invention Grant
US09190794B2 Method of retaining a solder material to a solder terminal and the solder assembly formed thereby
有权
将焊料材料保持到焊接端子的方法以及由此形成的焊料组件
- Patent Title: Method of retaining a solder material to a solder terminal and the solder assembly formed thereby
- Patent Title (中): 将焊料材料保持到焊接端子的方法以及由此形成的焊料组件
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Application No.: US13724303Application Date: 2012-12-21
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Publication No.: US09190794B2Publication Date: 2015-11-17
- Inventor: Chung-Nan Pao , Sun Wu Chou
- Applicant: CHIEF LAND ELECTRONIC CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: CHIEF LAND ELECTRONIC CO., LTD.
- Current Assignee: CHIEF LAND ELECTRONIC CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Li & Cai Intellectual Property (USA) Office
- Main IPC: H01R4/00
- IPC: H01R4/00 ; H01R4/18 ; H02G3/06 ; H02G15/08 ; H01R4/02 ; H01R4/62 ; H01R4/28 ; H01R4/10 ; H01R11/22 ; H01R13/11 ; B23K35/14 ; B21D39/00 ; B23K1/20 ; B23K31/00 ; B23K31/02 ; H01R43/02 ; H01R12/57 ; H01R43/16
Abstract:
The instant disclosure relates to a method of retaining a solder material onto a solder terminal comprising: a solder terminal and a solder material. The solder terminal includes a first surface, a second surface and a side, and is formed with a retaining hole. The solder material includes a winding portion, and a connection portion which extends on the opposite side from the winding portion of the solder material. The winding portion is arranged to cover the solder terminal along the first surface, the side and then the second surface. In addition, the connection portion is engaged with the solder terminal through the retaining hole and is bent like a hook.
Public/Granted literature
- US20140174821A1 METHOD OF RETAINING A SOLDER MATERIAL TO A SOLDER TERMINAL AND THE SOLDER ASSEMBLY FORMED THEREBY Public/Granted day:2014-06-26
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