Invention Grant
US09193812B2 Polymer powder, curable resin composition and cured material thereof
有权
聚合物粉末，固化性树脂组合物及其固化物
- Patent Title: Polymer powder, curable resin composition and cured material thereof
- Patent Title (中): 聚合物粉末，固化性树脂组合物及其固化物
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Application No.: US14364417Application Date: 2012-12-21
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Publication No.: US09193812B2Publication Date: 2015-11-24
- Inventor: Youko Hatae , Toshihiro Kasai
- Applicant: Mitsubishi Rayon Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Rayon Co., Ltd.
- Current Assignee: Mitsubishi Rayon Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Morgan, Lewis & Bockius LLP
- Priority: JP2011-279344 20111221; JP2012-035161 20120221; JP2012-217760 20120928
- International Application: PCT/JP2012/083361 WO 20121221
- International Announcement: WO2013/094759 WO 20130627
- Main IPC: C08L33/12
- IPC: C08L33/12 ; C08L63/00 ; C08F20/10 ; C08F20/14 ; H01B3/40 ; H01B3/44 ; C08F265/06 ; C08L51/00 ; H01L21/52 ; H01L23/00 ; C09K3/10 ; C08L51/06 ; C08F220/18 ; C08J3/12 ; H01L23/29 ; H01L33/56
Abstract:
A polymer powder (P) selected from a group consisting of (i) a polymer powder (P1) and (ii) a polymer powder (P2) is provided. The (i) polymer powder (P1) includes a (meth)acrylate-based polymer (A1) having a glass transition temperature of 0° C. or less, and the polymer powder has an acetone-soluble component of 5 mass % or more. The acetone-soluble component has a mass average molecular weight of 100,000 or more. The (ii) polymer powder (P2) has an acetone-soluble component of 2 mass % to 35 mass %, the acetone-soluble component has a mass average molecular weight of 100,000 or more, and has a volume average primary particle size (Dv) of 200 nm or more.
Public/Granted literature
- US20140350186A1 Polymer Powder, Curable Resin Composition and Cured Material Thereof Public/Granted day:2014-11-27
Information query
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