Invention Grant
- Patent Title: Multiple layer forming scheme for vertical cross point reram
- Patent Title (中): 垂直交叉点多层形成方案
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Application No.: US14246053Application Date: 2014-04-05
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Publication No.: US09196362B2Publication Date: 2015-11-24
- Inventor: Chang Siau , Tianhong Yan
- Applicant: SanDisk 3D LLC
- Applicant Address: US CA Milpitas
- Assignee: SANDISK 3D LLC
- Current Assignee: SANDISK 3D LLC
- Current Assignee Address: US CA Milpitas
- Agency: Vierra Magen Marcus LLP
- Main IPC: G11C13/00
- IPC: G11C13/00

Abstract:
Methods for forming non-volatile storage elements in a non-volatile storage system are described. In some embodiments, during a forming operation, a cross-point memory array may be biased such that waste currents are minimized or eliminated. In one example, the memory array may be biased such that a first word line comb is set to a first voltage, a second word line comb interdigitated with the first word line comb is set to the first voltage, and selected vertical bit lines are set to a second voltage such that a forming voltage is applied across non-volatile storage elements to be formed. In some embodiments, a memory array may include a plurality of word line comb layers and a forming operation may be concurrently performed on non-volatile storage elements on all of the plurality of word line comb layers or a subset of the plurality of word line comb layers.
Public/Granted literature
- US20140301131A1 MULTIPLE LAYER FORMING SCHEME FOR VERTICAL CROSS POINT RERAM Public/Granted day:2014-10-09
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