Invention Grant
- Patent Title: Irradiation target encapsulation assembly and method of assembly
- Patent Title (中): 照射目标封装组装及组装方法
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Application No.: US13241669Application Date: 2011-09-23
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Publication No.: US09196390B2Publication Date: 2015-11-24
- Inventor: Bradley D. Bloomquist , Christopher J. Monetta , Earl F. Saito
- Applicant: Bradley D. Bloomquist , Christopher J. Monetta , Earl F. Saito
- Applicant Address: US NC Wilmington
- Assignee: GE-HITACHI NUCLEAR ENERGY AMERICAS LLC
- Current Assignee: GE-HITACHI NUCLEAR ENERGY AMERICAS LLC
- Current Assignee Address: US NC Wilmington
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: G21G1/00
- IPC: G21G1/00 ; G21G1/02 ; G21C1/30 ; G21G1/04
Abstract:
In one embodiment, an irradiation target encapsulation assembly, includes a container, at least one first irradiation target disposed in the container, at least one second irradiation target disposed in the container, and a positioning structure configured to position the first irradiation target closer to an axial center of the container than the second irradiation target.
Public/Granted literature
- US20130077725A1 IRRADIATION TARGET ENCAPSULATION ASSEMBLY AND METHOD OF ASSEMBLY Public/Granted day:2013-03-28
Information query
