Invention Grant
- Patent Title: Electronic component assembly comprising a varistor and a semiconductor component
- Patent Title (中): 包括变阻器和半导体部件的电子部件组件
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Application No.: US12994143Application Date: 2009-05-22
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Publication No.: US09196402B2Publication Date: 2015-11-24
- Inventor: Thomas Feichtinger , Guenter Engel , Axel Pecina
- Applicant: Thomas Feichtinger , Guenter Engel , Axel Pecina
- Applicant Address: DE Munich
- Assignee: EPCOS AG
- Current Assignee: EPCOS AG
- Current Assignee Address: DE Munich
- Agency: Cozen O'Connor
- Priority: DE102008024480 20080521
- International Application: PCT/EP2009/056251 WO 20090522
- International Announcement: WO2009/141439 WO 20091126
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H01C1/084 ; H01C7/10 ; H01C7/12 ; H05K1/18 ; H05K1/02
Abstract:
An electric component assembly comprising a semiconductor component (1) and a carrier is specified, wherein the carrier contains a highly thermally conductive ceramic and is connected to a varistor body. Heat from the semiconductor component can be at least partially dissipated to the carrier (3) by means of the varistor body.
Public/Granted literature
- US20110261536A1 Electronic Component Assembly Comprising a Varistor and a Semiconductor Component Public/Granted day:2011-10-27
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