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US09196420B2 Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein 有权
嵌入板中的多层陶瓷电子元件和嵌入其中的多层陶瓷电子元件的印刷电路板

Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein
Abstract:
There is provided a multilayer ceramic electronic component, including a ceramic body having first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes having first and second lead portions; and first and second external electrodes extended from the first and second end surfaces of the ceramic body to the first and second side surfaces, respectively, wherein when a distance from an end portion of the first or second external electrode formed on the first or second side surface of the ceramic body to a point of the first or second external electrode connected to the first or second lead portion is defined as G, and a width of the first or second external electrode on the first or second side surface of the ceramic body is defined as BW, 30 μm≦G
Abstract(Chinese):

提供了一种多层陶瓷电子部件，包括具有彼此面对的第一和第二侧表面的陶瓷体以及彼此面对的第一和第二端面; 第一和第二内部电极具有第一和第二引线部分; 以及分别从陶瓷体的第一和第二端面延伸到第一和第二侧表面的第一和第二外部电极，其中当形成在第一或第二侧面上的第一或第二外部电极的端部的距离 陶瓷体的表面连接到第一或第二引线部分的第一或第二外部电极的点被定义为G，并且陶瓷体的第一或第二侧表面上的第一或第二外部电极的宽度为 定义为BW，30μm＆nlE;满足G

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