Invention Grant
US09196498B1 Stationary actively-cooled shadow ring for heat dissipation in plasma chamber
有权
固定式主动冷却阴影环，用于等离子体室内散热
- Patent Title: Stationary actively-cooled shadow ring for heat dissipation in plasma chamber
- Patent Title (中): 固定式主动冷却阴影环，用于等离子体室内散热
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Application No.: US14458021Application Date: 2014-08-12
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Publication No.: US09196498B1Publication Date: 2015-11-24
- Inventor: Roy C. Nangoy
- Applicant: Roy C. Nangoy
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor Zafman LLP
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/3065 ; H01J37/32 ; H01L21/78 ; H01L23/544 ; H01L21/67 ; H01L21/683 ; H01L21/673
Abstract:
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a plasma processing apparatus includes a processing chamber having a chamber wall. The plasma processing apparatus also includes a plasma source in an upper portion of the processing chamber. A sample support is included for situating a sample below the plasma source. An actively-cooled shadow ring having a cooling channel therein for cooling fluid transport is fixedly attached to the chamber wall of the processing chamber, between the plasma source and the sample support.
Information query
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