Invention Grant
- Patent Title: Electronic component, arrangement and method
- Patent Title (中): 电子元件，布置和方法
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Application No.: US14043185Application Date: 2013-10-01
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Publication No.: US09196554B2Publication Date: 2015-11-24
- Inventor: Ralf Otremba , Josef Höglauer , Jürgen Schredl , Xaver Schlögel , Klaus Schiess
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/13 ; H01L23/00 ; H01L25/065
Abstract:
An electronic component includes at least one semiconductor device and a redistribution board comprising at least two nonconductive layers and a conductive redistribution structure. The semiconductor device is embedded in the redistribution board and electrically coupled to the redistribution structure and the redistribution board has a side face with a step. An outer contact pad of the redistribution structure is arranged on the step.
Public/Granted literature
- US20150091176A1 Electronic Component, Arrangement and Method Public/Granted day:2015-04-02
Information query
IPC分类:
