Invention Grant
- Patent Title: Device and method for chip pressing
- Patent Title (中): 芯片压制装置及方法
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Application No.: US13585773Application Date: 2012-08-14
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Publication No.: US09196600B2Publication Date: 2015-11-24
- Inventor: Chih-Horng Horng
- Applicant: Chih-Horng Horng
- Applicant Address: TW Hsinchu
- Assignee: Ableprint Technology Co., Ltd.
- Current Assignee: Ableprint Technology Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Martine Penilla Group, LLP
- Priority: TW101108506A 20120313
- Main IPC: B30B15/34
- IPC: B30B15/34 ; H01L23/00

Abstract:
Disclosed are embodiments related to chip pressing devices. One such chip pressing device includes a bottom portion and a top portion, which is configured to be attached to or separated from the bottom portion, and has a compartment portion, an upper chamber, and a lower chamber, wherein the upper chamber is spaced apart from the lower chamber by the compartment portion. The upper chamber has one or more gas passages, the lower chamber has one or more gas inlets and one or more gas outlets, and the compartment portion has one or more through-holes. One or more pressing heads movably fit into the through-holes; one or more gas pressure sources connected to at least one of the gas passages of the upper chamber, wherein the upper chamber is pressurized, and one or more heated gas sources are connected to the one or more gas inlets of the lower chamber.
Public/Granted literature
- US20130240115A1 Device and Method for Chip Pressing Public/Granted day:2013-09-19
Information query