Invention Grant
- Patent Title: Semiconductor circuit structure and process of making the same
- Patent Title (中): 半导体电路的结构和制作过程相同
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Application No.: US13603426Application Date: 2012-09-05
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Publication No.: US09196623B2Publication Date: 2015-11-24
- Inventor: Shu-Cheng Lin , Zih-Song Wang , Yi-Shiang Chang
- Applicant: Shu-Cheng Lin , Zih-Song Wang , Yi-Shiang Chang
- Applicant Address: TW Hsinchu Science Park, Hsinchu
- Assignee: Powerchip Technology Corporation
- Current Assignee: Powerchip Technology Corporation
- Current Assignee Address: TW Hsinchu Science Park, Hsinchu
- Agent Winston Hsu; Scott Margo
- Priority: TW101112247A 20120406
- Main IPC: H01L21/426
- IPC: H01L21/426 ; H01L21/311 ; H01L21/308 ; H01L21/3213 ; H01L27/115 ; H01L29/66

Abstract:
A semiconductor circuit structure and process of making the same is provided in the present invention, comprising the steps of providing a substrate having a target layer and a hard mask layer, forming a patterned small core body group and a large core body group on the hard mask layer, forming a spacer material layer conformally on the substrate and the core body groups, forming filling bodies in each recess of the spacer material layer, performing a first etching process to remove exposed spacer material layer, using the filling bodies as a mask to perform a second etching process for patterning the hard mask layer, and using the patterned hard mask layer as a mask to perform a third etching process for patterning the conductive layer.
Public/Granted literature
- US20130264622A1 SEMICONDUCTOR CIRCUIT STRUCTURE AND PROCESS OF MAKING THE SAME Public/Granted day:2013-10-10
Information query
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