Invention Grant
- Patent Title: IGBT device with buried emitter regions
- Patent Title (中): 具有埋地发射极区域的IGBT器件
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Application No.: US14496937Application Date: 2014-09-25
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Publication No.: US09196714B2Publication Date: 2015-11-24
- Inventor: Davide Giuseppe Patti
- Applicant: STMICROELECTRONICS S.r.l.
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza (MB)
- Agency: Gardere Wynne Sewell LLP
- Priority: ITMI2010A2146 20101119
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/08 ; H01L29/10 ; H01L29/66

Abstract:
An embodiment of an IGBT device is integrated in a chip of semiconductor material including a substrate of a first type of conductivity, an active layer of a second type of conductivity formed on an inner surface of the substrate, a body region of the first type of conductivity extending within the active layer from a front surface thereof opposite the inner surface, a source region of the second type of conductivity extending within the body region from the front surface, a channel region being defined within the body region between the source region and the active layer, a gate element insulated from the front surface extending over the channel region, a collector terminal contacting the substrate on a rear surface thereof opposite the inner surface, an emitter terminal contacting the source region and the body region on the front surface, and a gate terminal contacting the gate element.
Public/Granted literature
- US20150048414A1 IGBT DEVICE WITH BURIED EMITTER REGIONS Public/Granted day:2015-02-19
Information query
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