Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14257451Application Date: 2014-04-21
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Publication No.: US09196722B2Publication Date: 2015-11-24
- Inventor: Nobuki Miyakoshi , Masanori Fukui
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Hauptman Ham, LLP
- Priority: JP2013-089799 20130422
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/49 ; H01L27/02

Abstract:
A semiconductor device includes, in a cell region thereof: a low resistance semiconductor layer; a drift layer; a base region; a high-concentration semiconductor region; and a gate electrode layer. The semiconductor device includes, in a peripheral region thereof: the low resistance semiconductor layer; the drift layer; which is formed over the low resistance semiconductor layer; a gate lead line; a gate finger; and a gate pad. The gate electrode layer and the gate lead line are electrically connected with each other by way of a resistor made of polysilicon containing an impurity, and an impurity concentration in polysilicon which forms the resistor is lower than an impurity concentration in polysilicon which forms the gate electrode layer.
Public/Granted literature
- US20140312416A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2014-10-23
Information query
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