Invention Grant
US09196725B2 Semiconductor structure having common gate and fabrication method thereof
有权
具有公共栅极的半导体结构及其制造方法
- Patent Title: Semiconductor structure having common gate and fabrication method thereof
- Patent Title (中): 具有公共栅极的半导体结构及其制造方法
-
Application No.: US14070538Application Date: 2013-11-03
-
Publication No.: US09196725B2Publication Date: 2015-11-24
- Inventor: Qiuhua Han , Xiaoying Meng
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
- Applicant Address: CN Shanghai
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee Address: CN Shanghai
- Agency: Anova Law Group, PLLC
- Priority: CN201310011743 20130111
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66

Abstract:
Various embodiments provide a semiconductor structure having a common gate and fabrication method of the semiconductor structure. In an exemplary method, after forming a first metal gate and a second metal gate, a conductive material layer can be formed at least at the boundary between the first metal gate and the second metal gate. Thus, one end of the conductive material layer can be connected to a first metal gate electrode, and the other end of the conductive material layer can be connected to a second metal gate electrode. The resistance between the first metal gate electrode and the second metal gate electrode can be effectively reduced. Gate voltages of an NMOS transistor and a PMOS transistor of the common gate can be the same.
Public/Granted literature
- US20140197480A1 SEMICONDUCTOR STRUCTURE HAVING COMMON GATE AND FABRICATION METHOD THEREOF Public/Granted day:2014-07-17
Information query
IPC分类: