Invention Grant
US09196732B2 Fin field effect transistor having tapered sidewalls, and method of forming the same
有权
具有锥形侧壁的鳍式场效应晶体管及其形成方法
- Patent Title: Fin field effect transistor having tapered sidewalls, and method of forming the same
- Patent Title (中): 具有锥形侧壁的鳍式场效应晶体管及其形成方法
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Application No.: US14102644Application Date: 2013-12-11
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Publication No.: US09196732B2Publication Date: 2015-11-24
- Inventor: Jhon Jhy Liaw
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/78 ; H01L29/66

Abstract:
The description relates to a fin field effect transistor (FinFET). An exemplary structure for a FinFET includes a fin having a first height above a first surface of a substrate, where a portion of the fin has first tapered sidewalls, and the fin has a top surface. The FinFET further includes an insulation region over a portion of the first surface of the substrate, where a top of the insulation region defines a second surface. The FinFET further includes a gate dielectric over the first tapered sidewalls and the top surface. The FinFET further includes a conductive gate strip over the gate dielectric, where the conductive gate strip has second tapered sidewalls along a longitudinal direction perpendicular to the first height, and a first width between the second tapered sidewalls in the longitudinal direction is greater at a location nearest to the substrate than a second width at a location farthest from the substrate.
Public/Granted literature
- US20140097506A1 FIN FIELD EFFECT TRANSISTOR, AND METHOD OF FORMING THE SAME Public/Granted day:2014-04-10
Information query
IPC分类: