Invention Grant
- Patent Title: Semiconductor light emitting device
- Patent Title (中): 半导体发光器件
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Application No.: US14286696Application Date: 2014-05-23
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Publication No.: US09196808B2Publication Date: 2015-11-24
- Inventor: Masakazu Takao , Mitsuhiko Sakai , Kazuhiko Senda
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2007-107130 20070416
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/60 ; H01L33/04 ; H01L33/10 ; H01L33/40 ; H01L33/46 ; H01L33/06 ; H01L33/30

Abstract:
A high luminance semiconductor light emitting device including a metallic reflecting layer formed using a non-transparent semiconductor substrate is provided. The device includes a GaAs substrate; a metal layer disposed on the GaAs substrate; and a light emitting diode structure. The light emitting diode structure includes a patterned metal contact layer and a patterned insulating layer disposed on the metal layer, a p type cladding layer disposed on the patterned metal contact layer and the patterned insulating layer, a multi-quantum well layer disposed on the p type cladding layer, an n type cladding layer disposed on the multi-quantum well layer, and a window layer disposed on the n type cladding layer. The GaAs substrate and the light emitting diode structure are bonded by using the metal layer.
Public/Granted literature
- US20140264267A1 SEMICONDUCTOR LIGHT EMITTING DEVICE Public/Granted day:2014-09-18
Information query
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