Invention Grant
- Patent Title: Boundary acoustic wave device
- Patent Title (中): 边界声波装置
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Application No.: US13845205Application Date: 2013-03-18
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Publication No.: US09196818B2Publication Date: 2015-11-24
- Inventor: Takashi Yamane , Takeshi Nakao
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-118601 20080430
- Main IPC: H01L41/187
- IPC: H01L41/187 ; H01L41/18 ; H03H9/02

Abstract:
A boundary acoustic wave device includes an LiTaO3 piezoelectric substrate, a first dielectric medium layer disposed on the piezoelectric substrate, a second dielectric medium layer disposed on the first medium layer and having a sound velocity different from the first medium layer, and an interdigital electrode disposed at the boundary between the piezoelectric substrate and the first medium layer. The sound velocity of the first medium layer is less than the sound velocity of LiTaO3. The sound velocity of the second medium layer is greater than the sound velocity of LiTaO3. The inequality (h/λ)×a≦0.05 is satisfied, where H is the thickness of the first medium layer, h is the thickness of the interdigital electrode, λ is the period of electrode fingers of the interdigital electrode, and a is the ratio of the density of a metal of the interdigital electrode to the density of Au.
Public/Granted literature
- US20140117810A1 BOUNDARY ACOUSTIC WAVE DEVICE Public/Granted day:2014-05-01
Information query
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