Invention Grant
- Patent Title: Wire harness and method of manufacturing wire harness
- Patent Title (中): 线束和制造线束的方法
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Application No.: US13976656Application Date: 2011-12-28
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Publication No.: US09197042B2Publication Date: 2015-11-24
- Inventor: Eiichi Toyama
- Applicant: Eiichi Toyama
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-292021 20101228
- International Application: PCT/JP2011/080598 WO 20111228
- International Announcement: WO2012/091174 WO 20120705
- Main IPC: H02G3/04
- IPC: H02G3/04 ; B60R16/02 ; H02G3/06
Abstract:
A wire harness includes: one or more conductive paths; and an outer member that includes a plurality of leading outer members, each having a tubular shape that passes along the one or more conductive paths; and a watercrosslinkable fixing member or a photocrosslinkable fixing member that bonds adjacent leading outer members of the plurality of leading outer members which are separate away from each other in a longitudinal direction of the one or more conductive paths.
Public/Granted literature
- US20130306371A1 WIRE HARNESS AND METHOD OF MANUFACTURING WIRE HARNESS Public/Granted day:2013-11-21
Information query
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