Invention Grant
- Patent Title: Ultrasonic transducer device, probe, electronic instrument, and ultrasonic diagnostic device
- Patent Title (中): 超声波换能器,探头,电子仪器和超声波诊断装置
-
Application No.: US13770153Application Date: 2013-02-19
-
Publication No.: US09197331B2Publication Date: 2015-11-24
- Inventor: Tsutomu Nishiwaki
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2012-038401 20120224
- Main IPC: H04B11/00
- IPC: H04B11/00 ; H01L41/47 ; B06B1/06 ; H01L41/047

Abstract:
An ultrasonic transducer device includes a substrate, a plurality of ultrasonic transducer elements, a wiring substrate and a wiring member. The substrate defines a plurality of openings arranged in an array pattern. Each of the ultrasonic transducer elements is provided in each of the openings on a first surface of the substrate. The wiring substrate is arranged to face a second surface of the substrate that is opposite from the first surface. The wiring substrate includes a first wiring part. The wiring member is connected to the substrate and the wiring substrate. The wiring member includes a second wiring part electrically connecting the ultrasonic transducer elements to the first wiring part.
Public/Granted literature
- US20130223192A1 ULTRASONIC TRANSDUCER DEVICE, PROBE, ELECTRONIC INSTRUMENT, AND ULTRASONIC DIAGNOSTIC DEVICE Public/Granted day:2013-08-29
Information query