A flip-up electronic product mounting structure includes a base frame shell having a pivot connection portion, a cover frame shell having a mating connection portion and a plug hole located in the mating connection portion, and a hinge including female hinge members fixedly mounted in the pivot connection portion, a male hinge member rotatably and axially movably mounted in the female hinge member with a plug portion located at one end thereof, and a displacement control device operable to move the male hinge member relative to the female hinge member to further engage the plug portion into the plug hole or disengage the plug portion from the plug hole. Thus, the invention facilitates the assembly of the flip-flop electronic product, enabling the flip-flop electronic product to have light, thin, short and small design characteristics.