Invention Grant
- Patent Title: Wire arrangement structure and electronic device using the same
- Patent Title (中): 电线布置结构和电子设备使用相同
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Application No.: US13903537Application Date: 2013-05-28
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Publication No.: US09197724B2Publication Date: 2015-11-24
- Inventor: Chun-Ta Huang , Kuan-Chung Shih , Chin-Yu Hsu
- Applicant: Chi Mei Communication Systems, Inc.
- Applicant Address: TW New Taipei
- Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW101120356A 20120606
- Main IPC: H04M1/02
- IPC: H04M1/02
Abstract:
A wire arrangement structure includes a first fixed rod, a second fixed rod, a movable rod, a wire, and an elastic member. The elastic member is connected to the movable rod. When the second fixed rod slides relative to the first fixed rod, the elastic member provides a force to move the movable rod to adjust the length of the wire.
Public/Granted literature
- US20130331154A1 WIRE ARRANGEMENT STRUCTURE AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2013-12-12
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