Invention Grant
- Patent Title: Camera module
- Patent Title (中): 相机模块
-
Application No.: US13683091Application Date: 2012-11-21
-
Publication No.: US09197796B2Publication Date: 2015-11-24
- Inventor: Hyun Ah Oh , Youn Baek Jeong , Se Jin Lee
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2011-0123090 20111123; KR10-2011-0125610 20111129; KR10-2011-0125612 20111129
- Main IPC: H04N5/225
- IPC: H04N5/225

Abstract:
Exemplary embodiments of a camera module are proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor, an IRCF (Infrared Cut Filter) installed at an upper surface of the base, and an adhesive member fixing the IRCF to the base.
Public/Granted literature
- US20130128108A1 CAMERA MODULE Public/Granted day:2013-05-23
Information query