Disclosed herein are different embodiments of a grounding apparatus, system and method, for use, in accordance with some embodiments, to ground an object to be coated in an electrostatic coating process. The apparatus generally comprises a structure and cover moveable relative to one another between a conductor receiving position and a covering position, such that a grounding conductor received therebetween may be conductively coupled therewith and at least partially covered thereby in the covered position. A removable grounding apparatus is also disclosed for positioning on an object support proximate a selected grounding location of the object.