Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US13531753Application Date: 2012-06-25
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Publication No.: US09198282B2Publication Date: 2015-11-24
- Inventor: Robert Charles Becker , Bruce W. Anderson
- Applicant: Robert Charles Becker , Bruce W. Anderson
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/18 ; H05K1/02 ; H05K3/00 ; H05K3/28

Abstract:
Apparatuses and methods include a printed circuit board having a flexible circuit material, a rigid material over the flexible circuit material, and a first opening extending from a top surface of the rigid material to a first circuit layer of the flexible circuit material, and wherein the rigid material acts as a stiffener for the flexible circuit material.
Public/Granted literature
- US20130341075A1 PRINTED CIRCUIT BOARD Public/Granted day:2013-12-26
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