Invention Grant
- Patent Title: Water absorbing resin particles, method for manufacturing water absorbing resin particles, absorption body, absorptive article, and water-sealing material
- Patent Title (中): 吸水树脂颗粒，吸水树脂颗粒的制造方法，吸收体，吸收性物品和水密封材料
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Application No.: US14127784Application Date: 2012-07-23
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Publication No.: US09199218B2Publication Date: 2015-12-01
- Inventor: Masayoshi Handa , Kenji Tanimura , Atsushi Heguri , Yuichi Onoda
- Applicant: Masayoshi Handa , Kenji Tanimura , Atsushi Heguri , Yuichi Onoda
- Applicant Address: JP Hyogo
- Assignee: Sumitomo Seika Chemicals Co., Ltd.
- Current Assignee: Sumitomo Seika Chemicals Co., Ltd.
- Current Assignee Address: JP Hyogo
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2011-170462 20110803; JP2011-170466 20110803; JP2011-170467 20110803; JP2011-170471 20110803; JP2011-170473 20110803; JP2011-170477 20110803; JP2011-218018 20110930; JP2011-218028 20110930
- International Application: PCT/JP2012/068615 WO 20120723
- International Announcement: WO2013/018571 WO 20130207
- Main IPC: C08F2/32
- IPC: C08F2/32 ; B01J20/26 ; C08J3/12 ; A61L15/26 ; A61L15/28 ; A61L15/48 ; A61L15/60 ; C08J3/075 ; C08F220/06
Abstract:
Disclosed is a water-absorbent resin particle in which the water-absorption rate of physiological saline is 1 second to 15 seconds, the median particle size is 100 μm to 600 μm, and the residual volatile component content is 1.5% by weight or less.
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