Invention Grant
US09199352B2 Polishing apparatus, polishing method and pressing member for pressing a polishing tool
有权
抛光装置，抛光方法和用于按压抛光工具的按压构件
- Patent Title: Polishing apparatus, polishing method and pressing member for pressing a polishing tool
- Patent Title (中): 抛光装置，抛光方法和用于按压抛光工具的按压构件
-
Application No.: US12986481Application Date: 2011-01-07
-
Publication No.: US09199352B2Publication Date: 2015-12-01
- Inventor: Masaya Seki , Kenya Ito , Masayuki Nakanishi
- Applicant: Masaya Seki , Kenya Ito , Masayuki Nakanishi
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2010-006674 20100115; JP2010-287242 20101224
- Main IPC: B24B9/00
- IPC: B24B9/00 ; B24B9/06 ; B24B21/00 ; B24B37/27
Abstract:
A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and to rotate the substrate and at least one polishing head disposed near the peripheral portion of the substrate. The polishing head has at least one protrusion extending along a circumferential direction of the substrate, and the polishing head is configured to press a polishing surface of a polishing tape by the protrusion against the peripheral portion of the substrate from above or below.
Public/Granted literature
- US20110237164A1 POLISHING APPARATUS, POLISHING METHOD AND PRESSING MEMBER FOR PRESSING A POLISHING TOOL Public/Granted day:2011-09-29
Information query
