Invention Grant
- Patent Title: Print head die
- Patent Title (中): 打印头模具
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Application No.: US14418478Application Date: 2012-09-25
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Publication No.: US09199461B2Publication Date: 2015-12-01
- Inventor: Mark H. Mackenzie , Garrett E. Clark
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Hewlett-Packard Patent Department
- International Application: PCT/US2012/057034 WO 20120925
- International Announcement: WO2014/051541 WO 20140403
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/14

Abstract:
Various configurations of print head die are described. In an example, a first print head die has first print structures disposed along a major dimension thereof perpendicular to the media path, the first print structures including a leading print structure with respect to the media path. A second print head die independent of the first print head die has second print structures disposed along a major dimension thereof perpendicular to the media path, the second print head die being staggered with respect to the first print head die along the media path, the second print structures including a leading print structure with respect to the media path. A portion of the second print structures overlap a portion of the first print structures by an extent between a minimum value and a linear function of a separation between the respective leading print structures of the first and second print head dies.
Public/Granted literature
- US20150239242A1 PRINT HEAD DIE Public/Granted day:2015-08-27
Information query
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