Invention Grant
- Patent Title: Acoustic sensor and method of manufacturing the same
- Patent Title (中): 声传感器及其制造方法
-
Application No.: US13104387Application Date: 2011-05-10
-
Publication No.: US09199837B2Publication Date: 2015-12-01
- Inventor: Takashi Kasai , Nobuyuki Iida , Tomofumi Nakamura
- Applicant: Takashi Kasai , Nobuyuki Iida , Tomofumi Nakamura
- Applicant Address: JP Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto
- Agency: Osha Liang LLP
- Priority: JP2010-109164 20100511
- Main IPC: B81B7/00
- IPC: B81B7/00 ; H04R19/00 ; H04R31/00

Abstract:
In an acoustic sensor, a diaphragm arranged on an upper side of a silicon substrate includes a back chamber, and an anchor supports the diaphragm. An insulating plate portion fixed to an upper surface of the silicon substrate covers the diaphragm with a gap. A conductive fixed electrode film arranged on a lower surface of the plate portion configures a back plate. The change in electrostatic capacitance between the fixed electrode film and the diaphragm outputs to the outside from a fixed side electrode pad and a movable side electrode pad as an electric signal. A protective film is arranged continuously with the plate portion at an outer periphery of the plate portion. The protective film covers the outer peripheral part of the upper surface of the silicon substrate, and the outer periphery of the protective film coincides with the outer periphery of the upper surface of the silicon substrate.
Public/Granted literature
- US20110278683A1 ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-11-17
Information query