Invention Grant
- Patent Title: Thermally shorted bolometer
- Patent Title (中): 热短路辐射热量计
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Application No.: US14504749Application Date: 2014-10-02
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Publication No.: US09199838B2Publication Date: 2015-12-01
- Inventor: Gary O'Brien , Fabian Purkl , Ando Feyh , Bongsang Kim , Ashwin K Samarao , Thomas Rocznik , Gary Yama
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Maginot Moore & Beck LLP
- Main IPC: G01J5/02
- IPC: G01J5/02 ; B81B7/00 ; B81B7/02 ; G01J5/08 ; G01J5/20
Abstract:
In one embodiment, A MEMS sensor assembly includes a substrate, a first sensor supported by the substrate and including a first absorber spaced apart from the substrate, and a second sensor supported by the substrate and including (i) a second absorber spaced apart from the substrate, and (ii) at least one thermal shorting portion integrally formed with the second absorber and extending downwardly from the second absorber to the substrate thereby thermally shorting the second absorber to the substrate.
Public/Granted literature
- US20150115160A1 Thermally Shorted Bolometer Public/Granted day:2015-04-30
Information query
