Invention Grant
- Patent Title: Thermoplastic resin, resin composition, and molding of high thermal conductivity
- Patent Title (中): 热塑性树脂,树脂组合物和高导热率的成型
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Application No.: US13983825Application Date: 2012-02-07
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Publication No.: US09200111B2Publication Date: 2015-12-01
- Inventor: Mitsuru Nakamura , Shusuke Yoshihara
- Applicant: Mitsuru Nakamura , Shusuke Yoshihara
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-024739 20110208
- International Application: PCT/JP2012/052700 WO 20120207
- International Announcement: WO2012/108412 WO 20120816
- Main IPC: C08G63/193
- IPC: C08G63/193 ; C08L67/02 ; C08G69/44 ; C08L77/12 ; C08G63/685

Abstract:
The thermoplastic resin in accordance with the present invention includes a unit (A) by 25 mol % to 60 mol %, the unit (A) having a biphenyl group, a linear unit (e.g., a linear aliphatic hydrocarbon chain) (B) by 25 mol % to 60 mol %, and a unit (C) by 1 mol % to 25 mol %, the unit (C) having a substituent selected from the group consisting of non-fused aromatic groups, fused aromatic groups, heterocyclic groups, alicyclic groups, and alicyclic heterocyclic groups, each of which has an effect of folding a main chain.
Public/Granted literature
- US20130313468A1 THERMOPLASTIC RESIN, RESIN COMPOSITION, AND MOLDING OF HIGH THERMAL CONDUCTIVITY Public/Granted day:2013-11-28
Information query
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