Invention Grant
- Patent Title: Composite material with polyamide particles
- Patent Title (中): 复合材料与聚酰胺颗粒
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Application No.: US13594819Application Date: 2012-08-26
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Publication No.: US09200125B2Publication Date: 2015-12-01
- Inventor: Yen-Seine Wang , Maureen Boyle
- Applicant: Yen-Seine Wang , Maureen Boyle
- Applicant Address: US CA Dublin
- Assignee: Hexcel Corporation
- Current Assignee: Hexcel Corporation
- Current Assignee Address: US CA Dublin
- Agent W. Mark Bielawski; David J. Oldenkamp
- Main IPC: C08K7/02
- IPC: C08K7/02 ; C08L63/00 ; C08J5/24 ; C08J5/04

Abstract:
Pre-impregnated composite material (prepreg) is provided that can be cured/molded to form composite parts having high compression strength under hot and wet conditions, as well as, high damage tolerance and interlaminar fracture toughness. The matrix resin includes a thermoplastic particle component that includes polyamide particles which are composed of the polymeric condensation product of a methyl derivative of bis(4-aminocyclohexyl)methane and an aliphatic dicarboxylic acid.
Public/Granted literature
- US20140058013A1 COMPOSITE MATERIAL WITH POLYAMIDE PARTICLES Public/Granted day:2014-02-27
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