Disclosed is a binder composition for mold formation including: one or more 5-position substituted furfural compounds selected from the group consisting of 5-hydroxymethylfurfural and 5-acetoxymethylfurfural; and a furfurylated urea resin. The content of the 5-position substituted furfural compound(s) in the binder composition for mold formation is preferably from 1 to 30% by weight, and the content of the furfurylated urea resin is preferably from 1 to 20% by weight.