Process for curing a thermoset resin comprising the step of contacting said resin with (i) one or more imines of the structure Formula (I), wherein —y=0 or 1, z=1-4, and y+z≧2, —X is independently selected from O, S, P, NH, N—R1, and N—OH, —R1 is selected from linear or branched, cyclic, bi-cyclic, or tri-cyclic alkylene groups with 2-18 carbon atoms, arylene groups with 6-12 carbon atoms, and aralkylene groups with 2-18 carbon atoms, —R2-R5 are individually selected from hydrogen, linear or branched alkyl groups having 1-18 carbon atoms, cycloalkyl groups having 3-12 carbon atoms, aryl groups having 6-12 carbon atoms, aralkyl groups having 6-18 carbon atoms, alkoxy groups having 1-6 carbon atoms, and aryloxy groups; —each of said R-groups may optionally be substituted with O, S, Si, P, or N-containing substituents, —R4 and R5; R3 and R4; R2, R5 and R1 and R3 may optionally form ring, and (ii) a peroxide.