Invention Grant
- Patent Title: Molding wall thickness recognition apparatus, molding wall thickness recognition system, and non-transitory computer readable medium
- Patent Title (中): 成型壁厚识别装置,成型壁厚识别系统和非暂时性计算机可读介质
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Application No.: US14617194Application Date: 2015-02-09
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Publication No.: US09200891B1Publication Date: 2015-12-01
- Inventor: Masanori Yoshizuka
- Applicant: FUJI XEROX CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJI XEROX CO., LTD.
- Current Assignee: FUJI XEROX CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2014-135249 20140630
- Main IPC: G01B11/28
- IPC: G01B11/28 ; G01B11/06 ; B29C37/00

Abstract:
Provided is a molding wall thickness recognition apparatus, including a calculation portion that calculates a surface area of each surface that configures a molded article in each wall thickness, based on three-dimensional shape information which illustrates a shape of the molded article having different wall thicknesses, and a determining portion that determines the wall thickness of the surface area that satisfies preset conditions as a basic wall thickness, by comparing each surface area in each wall thickness calculated by the calculation portion.
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