Invention Grant
- Patent Title: Photon doppler velocimetry for laser bond inspection
- Patent Title (中): 光子多普勒测速仪用于激光焊接检查
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Application No.: US13587411Application Date: 2012-08-16
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Publication No.: US09201017B2Publication Date: 2015-12-01
- Inventor: David F. Lahrman , Richard D. Tenaglia
- Applicant: David F. Lahrman , Richard D. Tenaglia
- Applicant Address: US OH Dublin
- Assignee: LSP Technologies, Inc.
- Current Assignee: LSP Technologies, Inc.
- Current Assignee Address: US OH Dublin
- Agency: Benesch, Friedland, Coplan & Aronoff LLP
- Agent Benjamen E. Kern; Christopher H. Bond
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01N21/84
Abstract:
Methods, systems, and apparatuses are disclosed for using Photon Doppler Velocimetry for laser bond inspection.
Public/Granted literature
- US20140049773A1 PHOTON DOPPLER VELOCIMETRY FOR LASER BOND INSPECTION Public/Granted day:2014-02-20
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