Invention Grant
US09201299B2 Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same
有权
无机填料和含有机填料的固化性树脂组合物，抗蚀剂膜涂布印刷线路板及其制造方法
- Patent Title: Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same
- Patent Title (中): 无机填料和含有机填料的固化性树脂组合物，抗蚀剂膜涂布印刷线路板及其制造方法
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Application No.: US13768734Application Date: 2013-02-15
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Publication No.: US09201299B2Publication Date: 2015-12-01
- Inventor: Toshimitsu Kounou , Yasuhiro Kuroyanagai , Yukihiro Usui , Makoto Obunai
- Applicant: SAN-El KAGAKU CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SAN-EI KAGAKU CO., LTD.
- Current Assignee: SAN-EI KAGAKU CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2007-280962 20071001; JP2008-244913 20080826
- Main IPC: G03F7/029
- IPC: G03F7/029 ; G03F7/004 ; C08L33/14 ; C08L63/04 ; G03F7/038 ; G03F7/075 ; C08F20/28 ; G03F7/033
Abstract:
A curable resin composition comprises: (I) 100 parts by weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 μm, wherein a content weight ratio of the components (II) and (III) is 1 to 41.
Public/Granted literature
Information query
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