Invention Grant
US09202596B2 Semiconductor device, semiconductor repair system including the same, and method for operating the semiconductor device 有权
包括其的半导体器件,半导体修复系统以及用于操作半导体器件的方法

  • Patent Title: Semiconductor device, semiconductor repair system including the same, and method for operating the semiconductor device
  • Patent Title (中): 包括其的半导体器件,半导体修复系统以及用于操作半导体器件的方法
  • Application No.: US14555416
    Application Date: 2014-11-26
  • Publication No.: US09202596B2
    Publication Date: 2015-12-01
  • Inventor: Seon-Ki ChoYong-Ho Kong
  • Applicant: SK hynix Inc.
  • Applicant Address: KR Gyeonggi-do
  • Assignee: SK Hynix Inc.
  • Current Assignee: SK Hynix Inc.
  • Current Assignee Address: KR Gyeonggi-do
  • Agency: IP & T Group LLP
  • Priority: KR10-2014-0049852 20140425
  • Main IPC: G11C29/00
  • IPC: G11C29/00 G11C17/16 G11C17/18
Semiconductor device, semiconductor repair system including the same, and method for operating the semiconductor device
Abstract:
A semiconductor device includes: a plurality of fuse arrays each including a plurality of fuses; a selection block which selects one fuse array among the fuse arrays in response to values of a group of bits of a repair code; a code alignment block which aligns disposition of bits other than the group of bits of the repair code, wherein the alignment disposition is changed based on the fuse array selected in the selection block; and an operation block which controls an operation of the fuse array selected in the selection block in response to a repair command and an output code of the code alignment block.
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