Invention Grant
- Patent Title: Conductive paste composition for external electrode and multilayer ceramic electronic component fabricated using the same
- Patent Title (中): 用于外部电极的导电糊组合物和使用其制造的多层陶瓷电子部件
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Application No.: US13912852Application Date: 2013-06-07
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Publication No.: US09202624B2Publication Date: 2015-12-01
- Inventor: Jae Choon Cho , Hee Sun Chun , Choon Keun Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2012-0062253 20120611
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G4/008 ; H01G4/30 ; H01G4/232 ; H01G4/12
Abstract:
There are provided a conductive paste composition for an external electrode and a multilayer ceramic electronic component fabricated using the same, the conductive paste composition for an external electrode including: a conductive metal powder; and a resin mixture including at least one resin selected from a group consisting of an epoxy-based resin and a phenoxy-based resin, and a polyvinyl formal resin.
Public/Granted literature
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