Methods for forming semiconductor device packages include applying an underfill material over a semiconductor wafer including conductive elements such that an average thickness of the underfill material is at least about 80% of an average height of the conductive elements and each conductive element is covered by underfill material. Underfill material covering tips of conductive elements is removed. Other methods include positioning a stencil over a semiconductor wafer and applying an underfill material to a major surface of the semiconductor wafer through the stencil. Additional methods include aligning and associating conductive elements having a surface substantially free of underfill material with bond pads of a substrate, melting and flowing the underfill material, and heating the conductive elements and underfill material to melt tip portions of the conductive elements and cure the underfill material.