Invention Grant
- Patent Title: Substrate treatment apparatus and substrate treatment method
- Patent Title (中): 基板处理装置及基板处理方法
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Application No.: US12621663Application Date: 2009-11-19
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Publication No.: US09202724B2Publication Date: 2015-12-01
- Inventor: Konosuke Hayashi
- Applicant: Konosuke Hayashi
- Applicant Address: JP Yokohama-shi
- Assignee: Shibaura Mechatronics Corporation
- Current Assignee: Shibaura Mechatronics Corporation
- Current Assignee Address: JP Yokohama-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-296301 20081120; JP2009-254548 20091106
- Main IPC: H01L21/465
- IPC: H01L21/465 ; H01L21/67 ; H01L21/02 ; B08B3/02 ; B08B9/08 ; B08B9/093 ; B08B9/28 ; F26B5/00
Abstract:
Provided is a substrate treatment apparatus that treats a surface of a substrate while rotating the substrate. The substrate treatment apparatus includes: a physical tool unit including a physical tool configured to treat the surface of the substrate; a nozzle unit including a liquid supply nozzle configured to supply a liquid to the surface of the substrate and a gas supply nozzle configured to supply a gas to the surface of the substrate; a physical-tool-unit moving mechanism configured to move the physical tool unit along the surface of the substrate; and a nozzle-unit moving mechanism configured to move the nozzle unit along the surface of the substrate.
Public/Granted literature
- US20100122772A1 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD Public/Granted day:2010-05-20
Information query
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