Invention Grant
- Patent Title: Heat pipe in overmolded flip chip package
- Patent Title (中): 热管在包覆成型的倒装芯片封装中
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Application No.: US13781278Application Date: 2013-02-28
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Publication No.: US09202772B2Publication Date: 2015-12-01
- Inventor: William Y. Hata
- Applicant: Altera Corporation
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Agency: Ward & Zinna, LLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/427 ; H01L21/48
Abstract:
The present invention is an improvement in a molded semiconductor package and the method for its manufacture. The package comprises a substrate, a semiconductor die mounted on the substrate, a molding compound encircling the die on the substrate, a lid on the molding compound, and a heat pipe extending between the semiconductor die and the lid. Preferably, the heat pipe is formed so that it encircles the die. The package is assembled by mounting the die on the substrate, applying the molding compound to the substrate while a channel is formed in the molding compound adjacent the semiconductor die, inserting a heat pipe material in the channel, and mounting the lid on the molding compound and the heat pipe material.
Public/Granted literature
- US20140239487A1 HEAT PIPE IN OVERMOLDED FLIP CHIP PACKAGE Public/Granted day:2014-08-28
Information query
IPC分类:
