Invention Grant
- Patent Title: LED module for modified lamps and modified LED lamp
- Patent Title (中): LED模块用于修改灯和改装LED灯
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Application No.: US13255694Application Date: 2010-02-26
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Publication No.: US09203001B2Publication Date: 2015-12-01
- Inventor: Peter Pachler
- Applicant: Peter Pachler
- Applicant Address: AT Jennersdorf
- Assignee: Tridonic Jennersdorf GmbH
- Current Assignee: Tridonic Jennersdorf GmbH
- Current Assignee Address: AT Jennersdorf
- Agency: Lee & Hayes, PLLC
- Priority: EP09154642 20090309; DE202009005453U 20090409
- International Application: PCT/EP2010/052459 WO 20100226
- International Announcement: WO2010/102911 WO 20100916
- Main IPC: H01L33/46
- IPC: H01L33/46 ; H01L33/60 ; F21Y101/02 ; F21K99/00
Abstract:
An LED module includes a printed circuit board (PCB) or a surface mount device (SMD) mount, an LED chip mounted on the PCB or the SMD mount, a cover mounted on the LED chip and a surface of the PCB or the SMD mount which surrounds the LED chip. The surface of the PCB or the SMD mount on which the spherical cover is mounted may be covered on its side walls with a white reflective material which is in contact with the LED chip.
Public/Granted literature
- US20120068204A1 LED MODULE FOR MODIFIED LAMPS AND MODIFIED LED LAMP Public/Granted day:2012-03-22
Information query
IPC分类:
