A light-emitting diode (LED) package includes a package substrate, a first electrode pad, a second electrode pad, an upper insulating layer and an LED chip. The first electrode pad is disposed on an upper surface of the package substrate and includes a groove. The second electrode pad includes a protruding portion disposed in the groove of the first electrode pad. The upper insulating layer insulates the first electrode pad from the second electrode pad on the package substrate. The LED chip includes a first electrode and a second electrode which are respectively electrically connected in the form of a flip-chip to the first electrode pad and the protruding portion of the second electrode pad.