Invention Grant
- Patent Title: Terminal manufacturing method
- Patent Title (中): 终端制造方法
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Application No.: US13866072Application Date: 2013-04-19
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Publication No.: US09203201B2Publication Date: 2015-12-01
- Inventor: Kazumasa Kobayashi
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2012-102554 20120427
- Main IPC: H01R43/16
- IPC: H01R43/16 ; H01R43/02 ; H01R12/58 ; H01R13/03 ; B21C1/02 ; B21C3/00 ; H01R12/71 ; H05K3/34

Abstract:
A manufacturing method is provided for a terminal (10) that has a board connecting portion (12) to be connected to a circular through hole (B1) formed to penetrate through a board (B). The manufacturing method includes a wire drawing step of manufacturing a wire material having a polygonal cross-section with obtuse interior angles by drawing the wire material through an opening of a wire drawing die, the opening having a polygonal shape with obtuse inner angles. The method then includes a surface processing step of applying a surface processing to the wire material, and a cutting step of cutting the wire material having the surface processing applied thereto to a specified length to form the terminal (10).
Public/Granted literature
- US20130288533A1 TERMINAL MANUFACTURING METHOD AND BOARD CONNECTOR Public/Granted day:2013-10-31
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