Invention Grant
- Patent Title: Electrical junction box
- Patent Title (中): 电接线盒
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Application No.: US14420446Application Date: 2013-08-21
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Publication No.: US09203224B2Publication Date: 2015-12-01
- Inventor: Masaki Yamamoto , Kazutoshi Kurachi , Kei Tomita , Taisuke Tomita , Takayoshi Marui
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-182963 20120822
- International Application: PCT/JP2013/072239 WO 20130821
- International Announcement: WO2014/030660 WO 20140227
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H02G3/16 ; H01R4/22

Abstract:
Provided is an electrical junction box which prevents a bonder cap from falling out of a bonder cap accommodating part without using a bundling tie. The electrical junction box includes a frame having a bonder cap accommodating part and a terminal-attached wire accommodating part, and a cover. An edge forming an insertion port of the bonder cap accommodating part includes a low pro file portion with the same height as that of an edge of the terminal-attached wire accommodating part and a projecting portion projecting beyond the low profile portion. In a state where the cover is attached to the frame, a distance between the low profile portion and the cover is longer than the full length of the bonder cap, and a distance between the most projected portion of the projecting portion and the cover is shorter than the full length of the bonder cap. The wire bundle outside the bonder cap accommodating part is bent toward the low profile portion.
Public/Granted literature
- US20150236489A1 ELECTRICAL JUNCTION BOX Public/Granted day:2015-08-20
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