Invention Grant
US09203340B2 Temperature estimation device estimating temperature of power semiconductor chip, and motor control device including the same
有权
功率半导体芯片的温度估计装置估计温度，以及包括其的电动机控制装置
- Patent Title: Temperature estimation device estimating temperature of power semiconductor chip, and motor control device including the same
- Patent Title (中): 功率半导体芯片的温度估计装置估计温度，以及包括其的电动机控制装置
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Application No.: US14300006Application Date: 2014-06-09
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Publication No.: US09203340B2Publication Date: 2015-12-01
- Inventor: Ryouta Yamaguchi
- Applicant: FANUC Corporation
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: Hauptman Ham, LLP
- Priority: JP2013-122165 20130610
- Main IPC: G05B5/00
- IPC: G05B5/00 ; H02P29/00 ; G01K7/42 ; H02P5/52
Abstract:
A temperature calculation unit calculates a temperature T1 of one power semiconductor chip as a temperature estimating target, from a reference temperature, a temperature difference ΔT1, and a temperature difference ΔT2. The temperature difference ΔT1 is calculated based on an electric power loss Q1 generated in all power semiconductor chips of a power semiconductor module containing one power semiconductor chip as the temperature estimating target. The temperature difference ΔT2 is calculated based on the electric power loss Q1 and an electric power loss Q2 generated in all power semiconductor chips of a power semiconductor module other than the power semiconductor module containing one power semiconductor chip as the temperature estimating target.
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