Invention Grant
- Patent Title: Power amplifier
- Patent Title (中): 功率放大器
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Application No.: US13433410Application Date: 2012-03-29
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Publication No.: US09203357B2Publication Date: 2015-12-01
- Inventor: Shinichi Miwa , Yoshihiro Tsukahara , Ko Kanaya , Naoki Kosaka
- Applicant: Shinichi Miwa , Yoshihiro Tsukahara , Ko Kanaya , Naoki Kosaka
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2011-170860 20110804
- Main IPC: H01L27/085
- IPC: H01L27/085 ; H01L23/66 ; H03F1/56 ; H01L27/02 ; H01L27/06 ; H03F3/195 ; H03F3/21 ; H03F3/24 ; H01L23/64 ; H01L21/8252

Abstract:
A power amplifier includes a semiconductor substrate including transistor cells, a drain electrode for the transistor cells located on the semiconductor substrate, a drain pad located on the semiconductor substrate and connected to the drain electrode, an ion-implanted resistance located in the semiconductor substrate and extending along and in contact with the drain pad, a floating electrode located on the semiconductor substrate and in contact with the ion-implanted resistance, and an output matching circuit located outside the semiconductor substrate. The power amplifier further includes a wire connecting the drain pad to the output matching circuit.
Public/Granted literature
- US20130032817A1 POWER AMPLIFIER Public/Granted day:2013-02-07
Information query
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