Invention Grant
- Patent Title: Multilayer substrate
- Patent Title (中): 多层基板
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Application No.: US14526698Application Date: 2014-10-29
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Publication No.: US09204545B2Publication Date: 2015-12-01
- Inventor: Shigetoshi Hayashi , Tomoya Yokoyama , Takako Sato
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2012-170067 20120731
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/03 ; H01L23/15 ; H01L23/498 ; H05K1/02 ; H05K1/09 ; H01L23/13

Abstract:
Provided is a multilayer substrate that can prevent generation of cracks caused by stress generated due to a difference between the coefficient of linear expansion of electrode pads and that of a ceramic material. An electrode pad arranged on a layer below an outermost component mounting electrode pad has a larger area than an area of the component mounting electrode pad. Similarly, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, and an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad.
Public/Granted literature
- US20150053467A1 MULTILAYER SUBSTRATE Public/Granted day:2015-02-26
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